Coated silicon carbide wafer scribing

Description
Evana Technologies owns a patented (portfolio ) scribing method for silicon carbide wafers. Silicon carbide is the perfect material to manufacture high power electronic devices, which find their applications in electric vehicle industry. This results in silicon carbide device market growth. Our refined scribing method for metal coated wafers offers high repeatability and good quality of the separated silicon carbide dies. 

 

Method features
  • Zero kerf
  • High scribing speed
  • No substrate chipping
  • Dicing streets can be very narrow
  • No peeling of semiconductor layers
  • Minimal thermal and mechanical stress

 

Product: Freezer03 

 

Flyers:  Sapphire and Silicon Carbide scribing (683 KB)

 

Media:

 

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