Silicon wafer scribing

 

Description
Evana Technologies owns a patented (portfolio ) scribing method for sapphire wafers. This method has been customized to be applicable for silicon wafer scribing. Our processing method stands out by high repeatability and reliability.

 

Method features
  • Zero kerf
  • High scribing speed
  • No debris produced during processing
  • Minimal thermal and mechanical stress to semiconductor layers
  • No substrate chipping and peeling of semiconductor and coating layers

 

Product: Freezer01 
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