Silicon wafer scribing
Description
Evana Technologies owns a patented (portfolio 
) scribing method for sapphire wafers. This method has been customized to be applicable for silicon wafer scribing. Our processing method stands out by high repeatability and reliability.
) scribing method for sapphire wafers. This method has been customized to be applicable for silicon wafer scribing. Our processing method stands out by high repeatability and reliability.
Method features
- Zero kerf
- High scribing speed
- No debris produced during processing
- Minimal thermal and mechanical stress to semiconductor layers
- No substrate chipping and peeling of semiconductor and coating layers
Product: Freezer01