Quartz and glass wafer scribing
Description
Our patented (portfolio ) scribing method is applicable to quartz and crystalline type glass substrates. Glass can be used in a wide variety of applications, such as manufacture of microelectromechanical systems, semiconductor and microfluidic chips or glass windows. Our method offers high production yields and good quality of separated dies.
Method features
- Zero kerf
- High scribing speed
- No debris produced during processing
- No substrate chipping
Product: Freezer01
Flyers: Glass scribing (618 KB)