ICICLE

Scribing of brittle transparent materials

Confirmed for: sapphire, silicon, quartz, glass, lithium niobate, lithium tantalate

Possible applications: potassium titanyl phosphate, other crystalline materials

Patents: US10074565(B2), EP3206829(B1) - further applied to GB, IE, DE, FR, NL, BE, LT, RU2674916(C2), TWI655986(B), JP6499300(B2)

Pending patents: CN107073653(A), KR20170067793(A)

Sapphire wafer scribing

Sapphire wafer laser scribing technology

We have developed a scribing method for sapphire wafers - a common substrate for light emitting diodes (LED).

Our laser scribing technology was adapted for scribing of quartz and glass wafers. This method is derived from our patented sapphire scribing technology.

Our sapphire scribing method was refined and applied to scribing of lithium niobate wafers - material, that is quite complicated to process.

Our sapphire scribing method was refined and applied to scribing of lithium tantalate wafers - commonly used material in optoelectronics and telecommunications.

We offer our sapphire sheet laser cutting method that can be applied to manufacture screens and covers of various size.

Technologies

ICICLE

Sapphire wafer scribing

Quartz and glass wafer scribing

Lithium niobate wafer scribing

Lithium tantalate wafer scribing

Sapphire laser cutting