ICICLE

Scribing of brittle transparent materials

Confirmed for: sapphire, silicon, quartz, glass, lithium niobate, lithium tantalate

Possible applications: potassium titanyl phosphate, other crystalline materials

Patents: US10074565(B2), EP3206829(B1) - further applied to GB, IE, DE, FR, NL, BE, LT, RU2674916(C2), TWI655986(B), JP6499300(B2)

Pending patents: CN107073653(A), KR20170067793(A)

Silicon wafer scribing

 
We have adapted our scribing method for silicon wafers - the most commonly used material for electronics manufacture.
 

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Sapphire wafer scribing

 
We have developed a scribing method for sapphire wafers - a common substrate for light emitting diodes (LED).
 

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Quartz and glass wafer scribing

 
Our laser scribing technology was adapted for scribing of quartz and glass wafers. This method is derived from our patented sapphire scribing technology.
 

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Lithium niobate wafer scribing

 
Our sapphire scribing method was refined and applied to scribing of lithium niobate wafers - material, that is quite complicated to process.
 

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Lithium tantalate wafer scribing

 
Our sapphire scribing method was refined and applied to scribing of lithium tantalate wafers - commonly used material in optoelectronics and telecommunications.
 

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Sapphire laser cutting

 
We offer our sapphire sheet laser cutting method that can be applied to manufacture screens and covers of various size.
 

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